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Thermal Engineer, Principal

**Company:**

Qualcomm Technologies, Inc.

**Job Area:**

Engineering Group, Engineering Group > Packaging Engineering

**General Summary:**

Qualcomm’s Hardware Systems is seeking a seasoned Thermal Engineer to contribute to the continued success of our industry-leading portfolio of chipset solutions. The qualified individual will be contributing to innovative solutions resolving complex thermal management challenges supporting various BUs and product lines. He/She will apply analytical skills on development of advanced thermal architecture solutions for a variety of hardware platforms including server, laptop, automotive, IOT, and mobile.

+ Thermal Engineering leader to support multiple projects from concept to post-production across various business units within Qualcomm.

+ Lead package and system cooling architecture through simulations while working with various non-thermal disciplines.

+ Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, lead thermal design reviews and presentations, and lead and mentor small size thermal teams.

+ Conduct research on advanced thermal management solutions applicable to complex electronics hosted across a spectrum of platforms from mobile to server level equipment.

+ Develop custom SW solutions to automate thermal modeling and test.

+ Perform thermal simulations utilizing CFD tools on various platforms.

+ Design, set up, run, and deliver results for various thermal experiments.

**Requirements**

+ Thorough understanding of electronics cooling technologies; passive, active, and liquid cooling.

+ Experience in thermal management of servers, laptops, and automotive electronics is highly desirable.

+ Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.

+ Experience in design, selection, and implementation of thermal management materials in consumer and industrial electronics.

+ Academic or industry exposure to 2.5/3D packaging is highly desirable.

+ Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for data analysis & tool development.

+ Expertise in conducting CFD simulations and proficiency in SW tools such as ANSYS-Icepak.

+ Capability to design and execute thermal tests within a laboratory environment, and hands on experience with airflow and temperature measurements equipment.

+ Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable.

+ Excellent presentation, negotiation, and communication skills.

+ Ability to clearly communicate complex technical content in written and verbal formats.

+ 10+ years of industry experience in electronics cooling.

+ Some experience with AI/ML concepts, algorithms, and methodologies is a plus."

**Education**

+ Required: MS in Mechanical Engineering

+ Preferred: PhD in Mechanical Engineering

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail myhr.support@qualcomm.com or call Qualcomm's toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hr\_public\_article\_view&sysparm\_article=KB0039028) . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities.

**To all Staffing and Recruiting Agencies** : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

**EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.**

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

**Pay range:**

$189,000.00 - $284,000.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer!

If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification


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