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Packaging Research and Development Engineer Graduate Intern

**Job Description**

Assembly and Test Technology Development (ATTD) Experimental Mechanics Lab deals with thermo-mechanical challenges in the development of advanced packaging technologies.

The personnel in this R&D lab use a variety of tools to study the behavior of electronic packages and their material constituents under different mechanical and/or thermal loading conditions: like dynamic warpage of packages using optics-based tools; interfacial adhesion strength using Double Cantilever Beam test; fracture toughness of bulk materials using three-point bend test; material CTE using Digital Image Correlation method; and defect (or crack) detection & classification using optical (or acoustic emission) sensors and AI and/ or ML codes.

Interns typically help develop new metrologies or software capabilities for use with next-gen packaging technologies. An ideal intern candidate is one with a strong background in Experimental Mechanics, along with problem solving and programming skills.

**This is an internship and compensation will be given accordingly based on candidate education level and internship duration.**


You must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience.

Minimum Qualifications:

+ You must currently be a student pursuing a graduate degree (MS/PhD) in one of the following majors: Mechanical Engineering, Materials Science & Engineering, or related field.

+ 6+ months of the experience with Mechanical Engineering, Materials Science & Engineering, or related field.

Preferred Qualifications:

+ 6+ months of experience in material characterization, load frames, DAQs, PID controllers, basic optics, and/or structural health monitoring.

+ 6+ months of experience in LabView, Matlab, and/or Python programming.

**Inside this Business Group**

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

**Posting Statement**

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Packaging Research and Development Engineer Graduate Intern

Phoenix, AZ

Published on 04/16/2021

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